Hot Semiconductor Stocks For 2015


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The Top Ten Stocks for April 3

U.S. stocks fell, dragging the Standard & Poor’s 500 Index down from a record, as financial and energy shares tumbled after oil plunged and worse-than-estimated data spurred concern over economic growth.

Bank of America Corp. and Morgan Stanley dropped more than 2.7 percent as financial shares tumbled the most among 10 S&P 500 groups. Energy companies sank as oil prices slid the most in more than four months after inventories climbed. An S&P gauge of homebuilders fell 33 percent, with PulteGroup Inc. slipping 4.3 percent. Zynga Inc. rallied 15 percent after saying it will introduce real-money online gambling in the U.K.

Hot Semiconductor Stocks For 2015: Applied Materials Inc.(AMAT)


Applied Materials, Inc. provides manufacturing equipment, services, and software to the semiconductor, flat panel display, solar photovoltaic (PV), and related industries worldwide. The company?s Silicon Systems Group segment offers a range of manufacturing equipment used to fabricate semiconductor chips or integrated circuits. This segment provides systems that perform primary processes used in chip fabrication, including atomic layer deposition, chemical vapor deposition, physical vapor deposition, electrochemical deposition, rapid thermal processing, chemical mechanical planarization, wet cleaning, and wafer metrology and inspection, as well as systems that etch or inspect circuit patterns on masks used in the photolithography process. Its Applied Global Services segment offers products and services designed to enhance the performance and productivity, and reduce the environmental impact of the fab operations of semiconductor, liquid crystal displays (LCDs), and solar P V manufacturers. The company?s Display segment provides products for manufacturing thin film transistor LCDs for televisions, personal computers (PCs), tablet PCs, smartphones, and other consumer-oriented electronic applications. Its Energy and Environmental Solutions segment offers manufacturing systems for the generation and conservation of energy, as well as manufacturing solutions for wafer-based crystalline silicon applications. This segment also provides roll-to-roll vacuum Web coating systems for deposition of a range of films on flexible substrates for functional, aesthetic, or optical properties; and roll-to-roll machine for depositing ultra-thin aluminum films for flexible packaging applications. The company serves manufacturers of semiconductor wafers and chips, flat panel LCDs, solar PV cells and modules, and other electronic devices. Applied Materials, Inc. was founded in 1967 and is headquartered in Santa Clara, California.


Advisors’ Opinion:

  • [By Tom Rojas and Maria Armental var popups = dojo.query(“.socialByline .popC”); ]

    Applied Materials Inc.(AMAT) on Wednesday warned its long-gestating deal to buy Tokyo Electron Ltd.(8035.TO) may close later than initially expected as talks with regulators continue. Shares slipped 0.8% to $21.07 premarket.

  • [By Jayson Derrick]

    Analysts at Bank of America upgraded Applied Materials (NASDAQ: AMAT) to Buy from Neutral with a $25 price target. Shares gained 0.47 percent, closing at $19.42.

  • [By Sue Chang and Ben Eisen]

    Applied Materials Inc. (AMAT)  shares rose 3%. Analysts at Jefferies initiated the stock at a buy with a price target of $28.

Hot Semiconductor Stocks For 2015: Analog Devices Inc (ADI)

Analog Devices, Inc. (Analog Devices), incorporated on January 18, 1965, is engaged in the design, manufacture and marketing of a range of analog, mixed-signal and digital signal processing integrated circuits (ICs). The Company produces a range of products, including data converters, amplifiers and linear products, radio frequency (RF) ICs, power management products, sensors based on micro-electro mechanical systems (MEMS) technology and other sensors, and processing products, including DSP and other processors, which are designed to meet the needs of a base of customers. The Company’s products are embedded inside many different types of electronic equipment, including industrial process control systems; instrumentation and measurement systems; wireless infrastructure equipment, and aerospace and defense electronics. The Company designs , manufactures and markets a range of ICs, which incorporate analog, mixed-signal and digital signal processing technologies. The Company ‘s product portfolio includes both general-purpose products used by a range of customers and applications, as well as application-specific products. On March 30, 2012, the Company acquired Multigig, Inc.


Analog Products

The Company’s product portfolio includes several thousand analog ICs. The Company’s analog IC customers include original equipment manufacturers (OEMs) and customers who build electronic subsystems for integration into larger systems. The Company is a supplier of data converter products. Data converters translate real-world analog signals into digital data and also translate digital data into analog signals. The Company is also a supplier of amplifiers. Amplifiers are used to condition analog signals. The Company provides precision, instrumentation, intermediate frequency/radio frequency (RF), broadband, and other amplifiers. The Company also offers a range of precision voltage references, which are used in a range of applications. The Company’s analog product line also includes a range port! folio of RF ICs covering the RF signal chain, from RF function blocks, such as phase locked loops, frequency synthesizers, mixers, modulators, demodulators, and power detectors, to broadband and short-range single chip transceiver solutions.


The Company’s RF ICs support the requirements of cellular infrastructure and a range of applications in the Company’s target markets. Also within the Company’s analog technology portfolio are products, which are based on MEMS technology. This technology enables the Company to build small sensors, which incorporate an electromechanical structure and the supporting analog circuitry for conditioning signals obtained from the sensing element. The Company’s MEMS product portfolio includes accelerometers used to sense acceleration, gyroscopes used to sense rotation, inertial measurement units used to sense multiple degrees of freedom combining multiple sensing types along multiple axis, and MEMS microphones used to sense audio. T he Company’s current revenue from MEMS products is derived from the automotive end market. In addition to the Company’s MEMS products, its other analog product category includes isolators. The Company’s isolators have been designed for applications, such as universal serial bus isolation in patient monitors, where it allows hospitals and physicians to adopt the advances in computer technology to supervise patient health and wirelessly transmit medical records. In smart metering applications, the Company’s isolators provide electrostatic discharge performance. In satellites, where any malfunction can be catastrophic, the Company’s isolators help protect the power system while enabling designers to achieve small form factors. Power management & reference products make up the balance of the Company’s analog sales. Those products, which include functions such as power conversion, driver monitoring, sequencing and energy management, are developed to complement analog signal chain components across core market segments from micro power, en! ergy-sens! itive battery applications to power systems in infrastructure and industrial applications.


Digital Signal Processing Products

Digital Signal Processing products (DSPs) complete the Company’s product portfolio. DSPs are optimized for numeric calculations, which are essential for instantaneous, or real-time, processing of digital data generated, from analog to digital signal conversion. The Company’s DSPs are designed to be fully programmable and to execute specialized software programs, or algorithms, associated with processing digitized real-time, real-world data. Programmable DSPs are designed to provide the flexibility to modify the device’s function using software. The Company’s DSP IC customers write their own algorithms using software development tools provided by the Company and third-party suppliers. The Company’s DSPs are designed in families of products, which share common architectures and therefore can execute the same software across a r ange of products. The Company’s customers use the Company’s products to solve a range of signal processing challenges across its core market and segment focus areas within the industrial, automotive, consumer and communications end markets. As an integrated part of the Company’s customers’ signal chain, there are other Analog Devices products connected to its processors, including converters, audio and video codecs and power management solutions.


The Company competes with Broadcom Corporation, Maxim Integrated Products, Inc., Cirrus Logic, Inc., Microchip Technology, Inc., Freescale Semiconductor, Inc., NXP Semiconductors, Infineon Technologies, ST Microelectronics, Intersil Corporation, Silicon Laboratories, Inc., Knowles Electronics, Texas Instruments, Inc. and Linear Technology Corporation.

Advisors’ Opinion:

  • [By ovenerio]

    The company has a current ROE of 22.99% which is higher than the one exhibit by Microchip Technology (MCHP), Analog Devices (ADI) and Nvidia Corp. (NVDA).In general, analysts consider ROE ratios in the 15-20% range as representing attractive levels for investment. So for investors looking those levels or more, Micron Technologies (MU) could be the option. It is very important to understand this metric before investing and it is important to look at the trend in ROE over time.

  • [By ovenerio]

    In this article, let’s take a look at Analog Devices, Inc. (ADI), a $15.79 billion market cap company, which is a company that manufactures high-performance integrated circuits (ICs) used in analog and digital signal processing applications.

  • [By Laura Brodbeck]

    Tuesday

    Earnings Expected: Bob Evans Farms (NASDAQ: BOBE), Analog Devices (NASDAQ: ADI), TiVo (NASDAQ: TIVO), Best Buy (NYSE: BBY), DSW (NYSE: DSW) Sanderson Farms (NASDAQ: SAFM) Economic Releases Expected: U.S. consumer confidence, U.S. house price index, U.S. Redbook, U.S. durable goods orders


    Wednesday

Hot Semiconductor Stocks For 2015: Texas Instruments Incorporated(TXN)

Texas Instruments Incorporated engages in the design and sale of semiconductors to electronics designers and manufacturers worldwide. The company?s Analog segment offers high-performance analog products comprising standard analog semiconductors, such as amplifiers, data converters, and interface semiconductors; high-volume analog and logic products; and power management semiconductors and line-powered systems. Its Embedded Processing segment includes DSPs that perform mathematical computations to process and enhance digital data; and microcontrollers, which are designed to control a set of specific tasks for electronic equipment. The company?s Wireless segment designs, manufactures, and sells application processors and connectivity products. Its Other segment offers smaller semiconductor products, which include DLP products that are primarily used in projectors to create high-definition images; and application-specific integrated circuits. This segment also provides handhe ld graphing and scientific calculators, as well as licenses technologies to other electronic companies. The company serves the communications, computing, industrial, consumer electronics, automotive, and education sectors. Texas Instruments Incorporated sells its products through a direct sales force, distributors, and third-party sales representatives. It has collaboration agreements with PLX Technology Inc.; Neonode, Inc.; and Ubiquisys Ltd. The company was founded in 1938 and is headquartered in Dallas, Texas.


Advisors’ Opinion:

  • [By Bob Ciura]

    It’s been an up-and-down year for semiconductor stock Texas Instruments (NASDAQ: TXN  ) . Its stock price fell significantly in September after a warning from one of its peers in the chip industry. However, Texas Instruments’ stock price has recovered from that and then some, because its underlying business has sailed through 2014 unscathed. Texas Instruments is growing — and rewarding its shareholders with lots of cash flow through billions of dollars in share buybacks and dividend payments

  • [By Myra Ramdenbourg]

    Texas Instruments Inc. (TXN): Sr. Vice President and CFO Kevin P. March sold 318,750 shares

    On 11/03/2014, Sr. Vice President and CFO Kevin P. March sold 318,750 shares at an average price of $50.01. The price of the stock has increased by 1.78% since. Texas Instruments Inc. has a market cap of $53.77 billion and its shares were traded at around $50.90. The company has a P/E ratio of 22.30 and P/S ratio of 4.33 with a dividend yield of 2.44%. Over the past 10 years, Texas Instruments Inc had an annual average earnings growth of 4.50%. GuruFocus rated Texas Instruments Inc the business predictability rank of 3-star.

  • [By Tom Rojas var popups = dojo.query(“.socialByline .popC”); popups.forEach(func]

    Texas Instruments Inc.(TXN) projected a fourth-quarter profit that tops Wall Street’s estimates as the chip maker also reported its third-quarter earnings rose 31% thanks to stronger sales and margins.

Hot Semiconductor Stocks For 2015: Broadcom Corporation(BRCM)

Broadcom Corporation designs and develops semiconductors for wired and wireless communications. It provides a portfolio of system-on-a-chip (SoC) and software solutions for the manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices, which enable the delivery of voice, video, data, and multimedia content to the home, office, and mobile environment. Its broadband communications products include cable modem SoCs; femtocell SoCs; MPEG/AVC/VC-1 encoders and transcoders; xDSL, passive optical network, and cable modem customer premises equipment and central office solutions; powerline networking SoCs; digital cable, direct broadcast satellite, terrestrial, and Internet protocol (IP) set-top box integrated receiver demodulators; high definition television and standard definition TV SoCs; and Blu-ray disc SoCs. The company?s mobile and wireless products comprise Wi-Fi and Bluetooth SoCs, wireless connectivity com bo chips, global positioning system SoCs, multimedia processors, applications processors, power management units, VoIP SoCs, mobile TV SoCs, and near field communications tags. Its infrastructure and networking products include Ethernet copper transceivers, Ethernet controllers and switches, backplane and optical front-end physical layer devices, security processors and adapters, and broadband processors. The company markets and sells its products through direct sales force, distributors, and manufacturers? representatives in the United States, as well as through regional offices, and a network of independent distributors and representatives in Asia, Australia, Europe, and North America. The company was founded in 1991 and is headquartered in Irvine, California.


Advisors’ Opinion:

  • [By Motley Fool Staff]

    Ashraf Eassa: I’ve been bullish on chip maker Broadcom (NASDAQ: BRCM  ) for quite a while now. Although some investors might be disappointed that the company wasn’t able to become the mobile processor powerhouse that the company itself had hoped, the remaining business continues to be incredibly compelling.

  • [By Ben Levisohn]

    Companies that could be hurt by tax reform due to their already low tax rates include Broadcom (BRCM) and Celgene (CELG), while Best Buy (BBY),  Madison Square Garden (MSG) and Gap (GPS) could benefit, Senyek says.

Hot Semiconductor Stocks For 2015: Aixtron SE (AIXG)


AIXTRON SE (AIXTRON), formerly AIXTRON AG, incorporated in 1983, is a provider of deposition equipment equipment to the semiconductor and compound-semiconductor industry. The Company’s technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and opto-electronic applications based on compound, silicon, or organic semiconductor materials. Such components are used in fiber optic communication systems, wireless and mobile telephony applications, optical and electronic storage devices, computing, signaling and lighting, displays, as well as a range of other technologies. AIXTRON’s business activities include developing, producing and installing equipment for coating semiconductor materials, process engineering, consulting and training, including ongoing customer support. AIXTRON supplies to customers both full production-scale complex material deposition systems and small scale systems for research and development (R&D) use and small-scale production use.


AIXTRON’s product range includes customized production and research scale compound semiconductor systems capable of depositing material films on up to 95 * two-inch diameter wafers per single production run, or smaller multiples of larger diameter wafers, employing MOCVD or Hydride Vapor Phase Epitaxy (HVPE) or organic thin film deposition on up to Gen. 3.5 substrates, including Polymer Vapor Phase Deposition (PVPD) or Organic Vapor Phase Deposition (OVPD) or large area deposition for Organic Light Emitting Diodes (OLED) applications or Plasma Enhanced Chemical Vapor Phase Deposition (PECVD) for depositing complex Carbon Nanostructures (Carbon Nanotubes, Nanowires or Graphene). AIXTRON also manufactures full production and research scale deposition systems for silicon semiconductor applications capable of depositing material films on wafers of up to 300 millimeters diameter, employing technologies, such as Chemical Vapor Depo sition (CVD), Atomic Vapor Deposition (AVD) and Atomic Layer! Deposition (ALD).


AIXTRON also offers a range of peripheral equipment and services, including products capable of monitoring the concentration of gases in the air and for cleaning the exhaust gas from metal organic chemical vapor deposition processes. The Company also assists its customers in designing the production layouts for the gas supply to thin film deposition systems. Additionally, the Company offers its customers training, consulting and support services.

The Company competes with Veeco Instruments Inc. (USA), Taiyo Nippon Sanso (Japan), Ulvac, Inc. (Japan), Tokki Corporation (Japan), Sumitomo (Japan), Applied Materials, Inc. (USA), Doosan DND Co., Ltd. (South Korea), Sunic System (South Korea), Tokyo Electron Ltd. (Japan), ASM International N.V. (Netherlands), IPS Technology (South Korea), Jusung Engineering Co. Ltd. (South Korea), and Hitachi Kokusai Electric Co. Inc. (Japan).


Advisors’ Opinion:

  • [By Rich Smith]

    This series, brought to you by Yahoo! Finance, looks at which upgrades and downgrades make sense and which ones investors should act on. Today, our headlines include upgrades for both industrialist Aixtron (NASDAQ: AIXG  ) and fashionista bebe stores (NASDAQ: BEBE  ) . But the news isn’t all good, so let’s start off with a few words on…

  • [By Jon C. Ogg]

    Aixtron SE (NASDAQ: AIXG) was downgraded to Sell from Hold at Canaccord Genuity.


    Buffalo Wild Wings Inc. (NASDAQ: BWLD) was downgraded to Outperform from Strong Buy at Raymond James.

Hot Semiconductor Stocks For 2015: Camtek Ltd (CAMT)

Camtek Ltd. (Camtek), incorporated in 1987, designs, develops, manufactures and markets automated solutions dedicated for enhancing production processes and yield for the semiconductor manufacturing and packaging and the printed circuit board (PCB) and integrated circuit (IC) substrate industries. Camtek also designs, develops, manufactures and markets automated optical inspection (AOI), systems and related products. The Company’s AOI systems are used to enhance both production processes and yields for manufacturers in the semiconductor manufacturing and packaging industry and PCB and IC Substrate industry. Through the acquisition of Printar’s assets, it also engaged in developing, manufacturing, sale and marketing of direct digital material deposition systems and inks for the PCB industry, with two major fields of activity: Solder Mask and Legend. In addition, through the acquisition of Sela, it is also engaged in the development, manufacturing and marketing of automate d scanning electron microscope (SEM) and transmission electron microscope (TEM) sample preparation equipment, primarily for the semiconductor industry.


As of December 31, 2011, the Company had sold more than 2,500 AOI systems in 34 countries worldwide. The Company’s PCB customer base includes the majority of the 100 PCB manufacturers worldwide. As of December 31, 2011, it had sold over 300 Falcon systems to more than 25 semiconductor manufacturers, among them outsourced semiconductor assembly and test (OSAT), integrated device manufacturers (IDM) and wafer level packaging subcontractors, including eight out of the top 10 semiconductors companies.

Camtek’s AOI systems consist of an electro-optical assembly unit, either movable or fixed, which consists of a video camera, precision optics and illumination sources. The electro-optical unit captures the image of the inspected product; a precise, either movable or fixed table, that holds the inspected product, and an electronic hardware unit, which operates the! entire system and includes embedded components that process and analyze the captured image by using its algorithms. Its systems can also compile and communicate statistical reports of inspection findings through the customer’s factory information system. The Company offers a range of systems for automated optical inspection of semiconductor wafers, IC substrates and PCBs. These systems are used to enhance production yields and assist in controlling manufacturing processes at wafer fabrication, test and assembly houses, and PCB plants worldwide.


The Company’s Falcon systems are designed for the back end market of the semiconductor industry. The Falcon’s advanced algorithms and inspection capabilities enable its dedicated models to detect defects in the die, which, if left undetected, may cause failure. The Condor is designed to meet the current and future inspection needs of the semiconductor industry. The Condor, through algorithms and advanced hardware configuration, is designed to enhance two dimensional (2D) and three dimensional (3D) detection abilities and increased throughput. The Condor family includes models for: 3D and 2D metrology and inspection of bumped-wafer prepared for packaging in the flip-chip technology; 2D metrology and inspection of finished wafers at the end of their manufacturing process and in test houses; Post-dicing inspection of frame-mounted wafers at assembly and packaging facilities, where it adds the value of detecting dicing-related damage, and inspection and metrology of micro-electro mechanical systems (MEMS) and other special applications.


Condor 5LED is an AOI system designed to provide solutions to a range of requirements that are to light emitting diode (LED) semiconductor manufacturers. The LED market’s special inspection requirements are characterized by 3-6 inch wafers, each of which may contain between 100 to over 200 thousand LED devices per wafer. Typically, the wafe r is made of a translucent compound semiconductor, such as g! allium ar! senide, gallium phosphide and/or indium phosphide. The Gannet system is designed for the front end market of the semiconductor industry.

The Company’s AOI products for this industry consist of five product lines: the Phoenix, Dragon and Orion for the inspection of inner and outer layers of PCB panels and ultra-fine-line IC substrate; large area masks (LAM) dedicated for inspection of artwork; and the Pegasus for final inspection (AFI) of IC substrates and high density interconnect (HDI) panels. The Phoenix product family, introduced in November 2011, is designed to support a range of the demanding PCB and IC substrate applications, while keeping in pace with the dynamic technology changes in the industry. The Phoenix product family is enhanced with Spark – Camtek’s and detection engine providing high detection capabilities, while minimizing false calls.


Dragon systems are high-throughput, automation-ready systems for inspection of all PCB types i n a mass production environment. Dragon models are optimized for specific PCB technology ranges – from mainstream circuits of typically 100 (microns) conductor line width, up to high density substrates having 12 (microns) wide conductive lines. All Dragon models are designed to interface with automated material handling mechanisms provided by the Company or other automation suppliers. Orion systems are stand-alone AOI systems for high volume inspection of all PCB types designed to operate in inspectify mode of operation. Inspectify is a mode of operation enabling the operator to perform verification immediately after inspection on the same system, thus saving time and eliminating handling-related defects.


LAM is specially designed for main-stream LAM inspection. It offers unparalleled detection ability on LAM with down to 25 (microns) line/space width technology. The LAM incorporates advanced technology innovations to ensure the level of detection that these ma sks require at this critical production stage. Camtek offers! various ! stand-alone verification systems that enable verification of panels after inspection. The Pegasus line includes systems for automated inspection of finished IC substrates that are subsequently used in packaging of ball grid array (BGA) and Chip Scale Package (CSP) devices. The Pegasus inspects both sides of the substrate, detecting process and mechanical defects, in particular in the gold-plated areas, where the substrate will interconnect with the silicon die or the PCB, and in the solder-mask areas. Pegasus models handle substrates in strip format in magazines.


GreenJet is a SM digital printing system aimed to replace the conventional SM application lines for prototypes and high mix low volume production. The GreenJet system offers manufacturers flexible and digital SM printing technology solution. The LGP system incorporates PCB digital legend printing technologies with specially developed heat curable ink, resulting in output and system performance. Camtek h as developed the inks for both LGP and GreenJet, which involves different chemicals mixed together in order to reach the required ink characterization.


The Company competes with Rudolph Technologies Inc., KLA-Tencor Corporation, Topcon Corporation, Toray Industries, Inc., Hitachi Ltd., Nidec Tosok Corporation., FEI Company, SII Nanotechnology Japan, Carl Zeiss, Inc., Orbotech Ltd., Dainippon Screen Manufacturing Company, Lloyd-Doyle Limited, Gigavis Co. Ltd., ATI Electronics Pty Ltd., Shirai Electronics Industrial Co. Ltd., First EIE SA and MicroCraft K.K.

Advisors’ Opinion:

  • [By Eddie Staley]

    In trading on Tuesday, technology shares were relative laggards, down on the day by about 1.68 percent. Top decliners in the sector included Camtek (NASDAQ: CAMT), down 15.54 percent, and MakeMyTrip (NASDAQ: MMYT), off 11.85 percent.

  • [By Garrett Cook]

    In trading on Tuesday, technology shares were relative laggards, down on the day by about 1.68 percent. Top decliners in the sector included Camtek (NASDAQ: CAMT), down 16.3 percent, and MakeMyTrip (NASDAQ: MMYT), off 11.4 percent.

Hot Semiconductor Stocks For 2015: Taiwan Semiconductor Manufacturing Co Ltd (TSM)

Taiwan Semiconductor Manufacturing Co., Ltd. is a Taiwan-based company principally engaged in the research, development, manufacture and distribution of integrated circuit (IC) related products. The Company operates its businesses through wafer manufacture, mask production, wafer testing and packaging components. The Company also involves in the provision of production management, customer services and design services. Its products and services are applied in the manufacture of personal computers and peripheral products, information related products, wire and wireless communication systems, automobile and industrial equipment, as well as consumer electronic products, such as digital disk players, digital televisions (TVs), game consoles, digital cameras, among others. Its customers include Altera, AMD, Broadcom, Marvell, NVIDIA, Qualcomm, Analog Devices, Freescale, NXP and Texas Instruments, among others. In July 2010, Taiwan Semiconductor Manufacturing Co. acquired mechan ical and engineering equipment from ASML HONG KONG LTD. In September 2010, the Company acquired a set of equipments from ASML HONG KONG LTD. In December 2010, the Company acquired a set of equipment from TOKYO ELECTRON LTD., KLA-TENCOR CORP. and NOVELLUS SYSTEMS INTERNATIONAL,B.V. In January 2011, the Company announced that it had acquired a set of equipment from KLA-TENCOR CORP., a set of equipment and facility, and another set of equipment from VARIAN SEMI. EQUIP. ASSOCIATES GmbH. In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc.In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc. In May 2011, it acquired a set of equipments form APPLIED MATERIALS SOUTH EAST ASIA PACIFIC LTD., Hamatech APE Gmbh and CO. KG, TOKYO ELECTRON LTD., DAINIPPON SCREEN MFG. CO., LTD., and VARIAN SEMI. EQUIP. ASSOCIATES GMBH.


TSMC’s customers include semiconductor companies, ranging from fabless semiconduct or and systems companies, such as Advanced Micro Devices, In! c., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., nVidia Corporation and Qualcomm Incorporated, to integrated device manufacturers, such as LSI Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 80%, and integrated device manufacturers accounted for approximately 20% of its net sales as of December 31, 2009.


The Company manufactures semiconductors using CMOS and BiCMOS processes. The BiCMOS process combines the speed of the bipolar circuitry and the power consumption and density of the CMOS circuitry. It uses the CMOS process to manufacture logic semiconductors, memory semiconductors, including static random access memory (SRAM), flash memory, mixed-signal/ radio frequency (RF) semiconductors, which combine analog and digital circuitry in a single semiconductor, micro-electro-mechanical-system (MEMS), which combines micrometer featured mechanical parts, analog and digital circuitry in a single semiconductor, and embedded memory semiconductors, which combine logic and memory in a single semiconductor. The BiCMOS process is used to make high-end mixed-signal and other types of semiconductors.


Advisors’ Opinion:

  • [By Motley Fool Staff]

    Need a reason to invest in stocks? How about the beginning of a new year. To help you find solid stock ideas we asked Fool.com contributors covering technology and consumer goods stocks to talk about top stocks for 2015. Read on to see what they had to say about Qualcomm (NASDAQ: QCOM  ) , Facebook (NASDAQ: FB  ) , SeaWorld Entertainment (NYSE: SEAS  ) , WhiteWave Foods (NYSE: WWAV  ) , Google (NASDAQ: GOOG  ) (NASDAQ: GOOGL  ) , Taiwan Semiconductor (NYSE: TSM  ) , and Apple (NASDAQ: AAPL  ) .

  • [By Ashraf Eassa]

    Would this be a surprise?
    Quite frankly, it wouldn’t be a surprise to see the first 14/16-nanometer mobile chips from Qualcomm come out in the timeframe stated above. TSMC (NYSE: TSM  ) , the world’s leading chip foundry, signaled that volume production on its 16-nanometer FinFET+ process would not begin until early Q3.

  • [By Wayne Duggan]

    Here's a modern example of the type of correlations Markowitz considered: an investment in Apple Inc. (NASDAQ: AAPL) and two of its suppliers, such as RF Micro Devices, Inc. (NASDAQ: RFMD) and Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE: TSM) might seem like one big investment in the iPhone. However, if the suppliers entered a price war to compete with each other, their margins would shrink and share prices might fall. Apple, on the other hand, would be paying less for its parts and would see an increase in margins (and share price).

  • [By Ashraf Eassa]

    A little while back, I wrote a piece looking at the potential options Apple (NASDAQ: AAPL  ) has for the manufacture of its next-generation A9 processor. The option that I pegged as least likely was that Apple would build another chip on Taiwan Semiconductor’s (NYSE: TSM  ) 20-nanometer manufacturing technology, particularly as the gains that Apple could see in moving to a 14-nanometer or 16-nanometer technology could be substantial.

Hot Semiconductor Stocks For 2015: Advanced Semiconductor Engineering Inc (ASX)


Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.


The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company’s global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company’s packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.


Packaging Services

The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no -lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company’s leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company’s substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).


The Company’s wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.


The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interc onnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.

Testing Services

The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.


The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mec hanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.

Advisors’ Opinion:

  • [By STOCKPICKR]

    We’re starting things off with Advanced Semiconductor Engineering (ASX), a Taiwan-based chipmaker. Overwhelmingly, overseas stocks have been lagging the broad market here at home — but that hasn’t been the case at Advanced Semiconductor. In fact, this $10 billion chip stock is up more than 30% since the calendar flipped to January. But investors should think about taking their gains here; ASX is starting to look toxic for your portfolio.


    That’s because ASX is currently forming a descending triangle pattern, a bearish price setup that’s formed by downtrending resistance above shares, and horizontal support to the downside at $5.80. Basically, as ASX bounces in between those two technical price levels, it’s getting squeezed closer to a breakdown below its $5.80 price floor — if that line in the sand gets violated, then Advanced Semiconductor is a sell.

    For short sellers, the most recent high at the $6.40 level is a logical place to park a protective stop.

    Must Read: 12 Stocks Warren Buffett Loves in 2014

  • [By Jeff Reeves]

    Next Page

    Best Stocks to Buy for Around $5: Advanced Semiconductor Engineering (ASX)

    Advanced Semiconductor Engineering (ASX) builds and distributes integrated circuits and other electronics. While that’s not as sexy as other chipmakers that play to mobile, it’s still a good business, considering the general demand for microchips in everything from cars to computers to TVs.

  • [By David Dittman]

    Crown Resorts is a buy all the way up to USD16.50 on the Australian Securities Exchange (ASX) using the symbol CWN and on the US over-the-counter (OTC) market using the symbol CWLDF.

Hot Semiconductor Stocks For 2015: ARM Holdings PLC (ARMH)


ARM Holdings plc (ARM), incorporated on October 16, 1990, designs microprocessors, physical intellectual property (IP) and related technology and software, and sells development tools. As of December 31, 2012, the Company operated in three business segments: the Processor Division (PD), the Physical IP Division (PIPD) and the System Design Division (SDD). ARM licenses and sells its technology and products to international electronics companies, which in turn manufacture, markets and sells microprocessors, application-specific integrated circuits (ASICs) and application-specific standard processors (ASSPs) based on ARM’s technology to systems companies for incorporation into a range of end products. It also licenses and sells development tools directly to systems companies and provides support services to its licensees, systems companies and other systems designers.


ARM processor architecture and physical IP is used in embedded microprocessor applications, i ncluding cellular phones, digital televisions, mobile computers and personal computer peripherals, smart cards and microcontrollers. ARM’s principal geographic markets are Europe, the United States and Asia Pacific. ARM’s product offering includes microprocessor Cores: RISC microprocessor cores, including specific functions, such as video and graphics IP and on-chip fabric IP; embedded software; physical IP; development tools, and support and maintenance services.


Processor Division

The PD encompasses those resources that are centered on microprocessor cores, including specific functions, such as graphics IP, fabric IP, embedded software IP and configurable digital signal processing (DSP) IP. Service revenues consist of design consulting services and revenues from support, maintenance and training.

Physical IP Division

The PIPD is focused on building blocks for translation of a circuit design into actual silicon. Durin g the year ended December 31, 2012, the Company’s total av! erage PIPD headcount was 557. ARM is a provider of physical IP components for the design and manufacture of integrated circuits, including systems-on-chip (SoCs). ARM Artisan physical IP products include embedded memory, standard cell and input/output components. Artisan physical IP also includes a limited portfolio of analog and mixed-signal products. ARM’s physical IP components are developed for a range of process geometries ranging from 20 nanometer – 250 nanometer. ARM licenses its products to customers for the design and manufacture of integrated circuits used in complex, high-volume applications, such as portable computing devices, communication systems, cellular phones, microcontrollers, consumer multimedia products, automotive electronics, personal computers and workstations and many others.


ARM’s embedded memory components include random access memories, read only memories and register files. These memories are provided in the form of a configurabl e memory compiler, which allows the customer to generate the appropriate configuration for the given application. ARM’s memory components include many configurable features, such as power-down modes, low-voltage data retention and fully static operation, as well as different transistor options to trade off performance and power. In addition, ARM’s memory components include built-in test interfaces that support the industry test methodologies and tools. ARM memory components also offer redundant storage elements.

ARM’s memory components are designed to enable the chip designer maximum flexibility to achieve the optimum power, performance, and density trade-off. ARM offers standard cell components that are optimized for high performance, high density or ultra high density. ARM logic products deliver optimal performance, power and area when building ARM Processors, Graphics, Video and Fabric IP along with general SoC subsystem implementation. ARM delivers phy sical interface for a range of DDR SDRAM (double-data rate s! ynchronou! s dynamic random-access memory) applications ranging from mission critical applications to low-power memory sub-systems. Silicon on Insulator (SOI) products is an alternative methodology to traditional semiconductor fabrication techniques.

System Design Division

The SDD is focused on the tools and models used to create and debug software and system-on-chip (SoC) designs. ARM’s software development tools help a software design engineer deliver products right the first time. Engineers use these tools in the design and deployment of code, from applications running on open operating systems right through to low-level firmware. The ARM Development Studio is a hardware components that allow the software designer to connect to a real target system and control the system for the purposes of finding errors in the software. The ARM DSTREAM unit allows the software developer to control the software running on the prototype product and examine the internal st ate of the prototype product. ARM Development Boards are ideal systems for prototyping ARM-based products. The ARM Microcontroller Development Kit supports ARM-based microcontrollers and 8051-based microcontrollers from companies, such as Analog Devices, Atmel, Freescale, Fujitsu, NXP, Samsung, Sharp, STMicroelectronics, Texas Instruments and Toshiba. The ARM Microcontroller Development Kit is used by developers who are building products and writing software using standard off-the-shelf microcontrollers.

The ARM Microprocessor Families

ARM architecture processors offers a range of performance options in the ARM7 family, ARM9 family, ARM11 family, ARM Cortex family and ARM SecurCore family. The ARM architecture gives systems designers a choice of processor cores at different performance/price points. The ARM7 offers 32-bit architecture capable of operating from 8/16-bit memory on an 8/16-bit bus through the implementation of the Thumb instruction set . The ARM9 family consists of a range of microprocessors in ! the 150-2! 50MHz range. Each processor has been designed for a specific application or function, such as an application processor for a feature phone or running a wireless fidelity (WiFi) protocol stack. The ARM9 family consists of a range of microprocessors in the 150-250 megahertz range. The ARM11 family consists of a range of microprocessors in the 300-600 megahertz range. ARM Cortex family is ARM’s family of processor cores based on version 7 of the ARM Architecture. The family is split into three series: A Series, A Series and M Series.

Advisors’ Opinion:

  • [By Motley Fool Staff]

    Most investors are familiar with the adage: “Buy low, sell high.” However, in reality it’s often difficult to buy a beaten down stock when everyone else seems to be running for the hills. Nevertheless, this can be a very rewarding strategy for patient investors. Below, the Motley Fool’s contributors explain why Intel Corporation (NASDAQ: INTC  ) , IBM  (NYSE: IBM  ) , and ARM Holdings (NASDAQ: ARMH  ) are three tech stocks poised to make a serious comeback in the quarters ahead.

  • [By Jayson Derrick]

    According to Bloomberg, Microsoft (NASDAQ: MSFT) is testing a Windows server that runs on ARM (NASDAQ: ARMH) server chips. Shares lost 0.48 percent, closing at $45.91.

  • [By Ashraf Eassa]

    Liliputing reported Rockchip is “showing off one of the first chipsets” based on the partnership that Intel (NASDAQ: INTC  ) and Rockchip announced back in May. In particular, it looks as though this is a dual core ARM (NASDAQ: ARMH  ) Cortex A5 processor which has an integrated 2G/3G modem as well as separate RF chip that integrates 2G/3G RF, Wi-Fi/Bluetooth, and GPS functionality.

  • [By Piyush Arora]

    AMD may have an ace up its sleeve, however. The chipmaker intends to aggressively capture the server market with its ARM (NASDAQ: ARMH  ) -based Opteron offerings. In my opinion, this product direction has the potential to propel AMD’s growth going forward.